Our SMD – Surface Mounted Devices equipments are capable of mounting flexibly from 1 piece prototype through few 100’s up to a few thousand series.
We are able to take on from the 0402 size SMD components to FP és BGA/uBGA packaged integrated chips.
Our usual deadline is maximum 10 days.
Tin paste placement
We can provide 2 kinds of technologies for tin paste placement:
• stencil printer
• dispenser(leaded, or lead-free) according to customer specification
While the automated stencil printer enables highly accurate homogenous spreading, dispenser aided pasting under certain criteria (0603 packaged components to SOP packaged integratred circles) can be the more cost beneficial solution. It needs to be said for BGA requires stencil.
Further advantage of stencil is its multi-board layout possibility on a 420x445 mm max printing area, yet again saving costs.
SMD mounting
We run Samsung Full Vision system Pick & Place Automated insertion machines.
Unbeatable plus of Pick & Place is its flexibility for component preparation.
The integrated board can be mounted in tube, reel or in tray, machine can cope with all these insertion modes.
• Accuracy: 50um
• Speed: ~14.900 component /hour
• PCB size: 50mm x 40mm – 420mm x 390mm
SMD soldering
In HELLER 7 zone convection reflow oven, which aids today’s expectations of quality and heat-profiles.
SMD repair
Microscopic visual inspections of solder joints and repairs are carried out by our high-skill colleagues. The precise repair is possible with adjustable temperature, component specific ERSA work stations and LEISTER air heaters.
Final inspection
Our products are not only on line and microscope checked but they are 100% visually inspected before shipment.